ChipletT & ChipsetT

Two new ultra thin advanced embedded die packaging solutions suitable for single and multi-die System in Package applications.

Based on Fujikura WABE Technology^TM, this product family offers unrivalled package form-factor reduction compared with alternative embedded die technologies whilst maintaining industry leading reliability performance. An innovative package platform that opens new doors to system layout and design freedom through its inherent enhanced functional density.

Wafer Level Packaging

FlipChip International, LLC (FCI) is the world’s premier technology and merchant supplier of advanced Wafer Level Packaging solutions. FCI offers a wide range of leading edge technologies and services for flip chip wafer bumping based on our proprietary Standard Flip Chip (SFC) and Wafer Level Chip Scale Packaging (WLCSP) processes. With the industry’s broadest range of thin film redistribution, underbump metallurgy and solder alloy options, FCI can provide optimized bumping solutions targeting our customer’s specific reliability and electrical performance requirements. More than 1 million wafers per year are processed with FCI’s family of technologies.

FlipChip International: Die Sales Division

Complimenting Flipchip International’s world class Wafer Bumping & WLCSP capabilities, our WAFER BACKEND SERVICES are provided under the rigorous quality standards of ISO9001 / TS16949.  FCI is also ISO 14001 certified, and ITAR registered.

RoseStreet Labs