Wafer Level Packaging
FlipChip International, LLC (FCI) is the world’s premier technology and merchant supplier of advanced Wafer Level Packaging solutions. FCI offers a wide range of leading edge technologies and services for flip chip wafer bumping based on our proprietary Standard Flip Chip (SFC) and Wafer Level Chip Scale Packaging (WLCSP) processes. With the industry’s broadest range of thin film redistribution, underbump metallurgy and solder alloy options, FCI can provide optimized bumping solutions targeting our customer’s specific reliability and electrical performance requirements. More than 1 million wafers per year are processed with FCI’s family of technologies.