FlipChip International Mourns Passing of Bob Forcier, President & CEO of FCI

With great sadness, the FCI family mourns the untimely passing of our President, CEO, and most of all friend Bob Forcier.

Message from Steve Sanghi, acting CEO and Chairman of FCI…

FlipChip International Announces Elite™ OPM Technology for High Yield Copper Wire Bonding on Multiple Nodes of Semiconductor Devices

Phoenix AZ, March 18th, 2013 – FlipChip International (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today its Elite™ OPM technology which  provides a wider process window for copper wire bonding to support the growing transition of  customer products away from costly gold wire… Read More…

FlipChip International Announces the Acquisition of Millennium Microtech Holdings Corporation and Controlling Interest in Millenium Microtech Shanghai

Phoenix AZ  July 9th, 2012 – FlipChip International – (FCI), a global technology leader in Wafer Level Packaging and flip chip wafer bumping, announced today the acquisition of Millennium Microtech Holdings Corporation (MMH) of the Cayman Islands through a strategic Merger with FCI’s Cayman Island entity.    FCI’s acquisition of MMH results in FCI securing controlling interest in Millennium Microtech (Shanghai) (MMS), located in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China.  READ MORE…

ChipletT & ChipsetT

Two new ultra thin advanced embedded die packaging solutions suitable for single and multi-die System in Package applications.

Based on Fujikura WABE Technology^TM, this product family offers unrivalled package form-factor reduction compared with alternative embedded die technologies whilst maintaining industry leading reliability performance. An innovative package platform that opens new doors to system layout and design freedom through its inherent enhanced functional density.

FlipChip International Announces the Acquisition of Millennium Microtech Holdings Corporation and Controlling Interest in Millenium Microtech Shanghai

Phoenix AZ  July 9th, 2012 – FlipChip International – (FCI), a global technology leader in Wafer Level Packaging and flip chip wafer bumping, announced today the acquisition of Millennium Microtech Holdings Corporation (MMH) of the Cayman Islands through a strategic Merger with FCI’s Cayman Island entity.    FCI’s acquisition of MMH results in FCI securing controlling interest in Millennium Microtech (Shanghai) (MMS), located in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China.  READ MORE…

Wafer Level Packaging

FlipChip International, LLC (FCI) is the world’s premier technology and merchant supplier of advanced Wafer Level Packaging solutions. FCI offers a wide range of leading edge technologies and services for flip chip wafer bumping based on our proprietary Standard Flip Chip (SFC) and Wafer Level Chip Scale Packaging (WLCSP) processes. With the industry’s broadest range of thin film redistribution, underbump metallurgy and solder alloy options, FCI can provide optimized bumping solutions targeting our customer’s specific reliability and electrical performance requirements. More than 1 million wafers per year are processed with FCI’s family of technologies.

FlipChip International: Die Sales Division

Complimenting Flipchip International’s world class Wafer Bumping & WLCSP capabilities, our WAFER BACKEND SERVICES are provided under the rigorous quality standards of ISO9001 / TS16949.  FCI is also ISO 14001 certified, and ITAR registered.

RoseStreet Labs