Phoenix, AZ Sep. 15, 2015 – FlipChip International – (FCI), the global technology leader in flip chip bumping and Wafer-Level Packaging, will be returning and exhibiting at the International Wafer-Level Packaging Conference (IWLPC) in San Jose, California on October 13-14th.
FCI invites you to join them at booth 29 at the 12th annual IWLPC. The annual SMTA and Chip Scale Review Conference brings together some of the leading experts in Semiconductor Advanced Packaging. Topics include MEMS packaging, 3D and Wafer-Level Packaging. FCI will be offering technical support on a broad range of advanced wafer level packaging technologies and highlighting world-class service, quality, and reliability. On display will be FCI’s product offerings which highlight FCI’s position as a technology leader in Wafer Level Packaging. These products provide global support to the world’s leading semiconductor and fabless semiconductor companies.