Test

FCI offers Wafer Probe Test services for 200mm (8 inch) and 150mm (6 inch) wafers. FCI partners with its customers designing and implementing the test program, probe card and test system, providing a full turnkey solution. This provides our customers with the highest quality product that is bumped, tested, diced and placed into tape and reel for the next level of assembly.


Magnum PV Tester

Configuration
  • Wafer sort applications from engineering to high volume production
  • 512 I/O pins 128/256 Power
  • Single chassis manipulator mount
Memory
  • NOR Flash / NAND Flash / SRAM / DRAM / EEPROM
Single, Scalable Platform
  • Scales from low-channel count engineering solutions to high-channel count production solutions with superior throughput and high parallel test efficiency
  • One platform tests a variety of memory and logic devices, including Memory, Embedded Memory and Logic Test
Multisite Architecture
  • Highly parallel tester architecture automates the task of testing up to 640 devices in parallel
All I/O channels
  • Maximizes utilization of tester resources and maximizes parallelism
  • Provides maximum flexibility in mapping memory and logic devices into the available pin resources
ECR Memory per DUT
  • Each DUT's failure information is captured into unique memory space and is not shared with other DUTs
  • Each of 64 I/O pins failure are addressed abd mapped into unique memory space for highly parallel error capture performance

Prober: TSK UF200FL UF200A/AL

Feature
  • Thinned wafer handling capability
  • Perform transfer and testing on 6 to 8 inch wafer
Option
  • Hinge-type manipulator for test-head
  • SEMS transfer by special mechanism
  • Testing environment for minute electric current
  • High-voltage testing environment
  • Wide variety of network environment
  • Needle track inspecting function

Focus Tester FTI-1000

The FTI 1000 tester consists of independent test channels that allow all DC and AC MOSFET parameters to be tested either separately, or in one handler insertion or prober touch-down.

The MOSFET AC parameters tested by the FTI 1000 include Inductive Load (UIL/UIS), Gate Charge (Qg, Qgs, Qgd), Gate Resistance (Rg), Gate Capacitance (Cg, Ciss) and high voltage Switching/Timing Tests. FTI 1000 also offers analog test resources to enable Smart Power devices to be tested.

FTI 1000: Power Management IC Test

FTI 1000 performs IC and Multi-Chip Module testing using the IC Channel Board equipped with:

  • Multiple Quad VI’s
  • TMU
  • Pulse Generators
  • Comparators
  • Digital Instruments
  • C Bits with Readback
  • Additional channel boards can be easily added, depending on the required configuration, and each channel board can be synchronized by a cabled ‘Sync Bus’