FlipChip’s Phoenix, AZ based facility is a state of the art 16,000- ft2 (4700 m2), class 1000 clean room. FlipChip – Phoenix is ISO/TS16949:2009 and ISO 14001 certified.
In addition to offering the industry’s broadest assortment of wafer bumping options, FlipChip has maintained an aggressive program to develop and generate intellectual property for future implementation at FlipChip-Phoenix and in our Asian factory locations.
Our commitment to leadership and quality in wafer bumping solutions continues, ensuring that FlipChip remains the leader in developing, and bringing to market the latest in bumping technology. The primary bumping facility and technology development site for FlipChip is located in the World Headquarters building in Phoenix, Arizona, USA.
History of FlipChip International
FlipChip International, LLC (FCI) began as Flip Chip Technologies (FCT), a joint venture between Delco Electronics Systems and Kulicke & Soffa Industries (K&S).
Delco contributed the patented Flex-On-Cap (or FoC) flip chip process and over 30 years of flip chip experience from the automotive industry to this partnership. K&S added its knowledge and leadership position as the world’s largest supplier of semiconductor assembly equipment. The company’s Flex-on-Cap (FoC) standard flip chip bumping technology quickly became the industry standard for flip chip bumping.
FCT developed and patented the UltraCSP® Wafer Level Chip Scale Package (WLCSP), which quickly became the industry standard for WLCSPs. FlipChip began an aggressive licensing program to bring its unique bumping technology to a broader worldwide market.
Today, the semiconductor industry’s packaging heavyweights, including Amkor Technology, Advanced Semiconductor Engineering (ASE), Siliconware (SPIL), and STATS ChipPAC have licensed and use FlipChip’s bumping technology as the foundation of their bumping capabilities.
K&S acquired Delco’s remaining interest in FCT and we became the Flip Chip Division of Kulicke & Soffa.
RoseStreet Labs, LLC, a private research and development company based in Phoenix, completed the acquisition of the assets of the Flip Chip Division from Kulicke & Soffa, through its newly formed subsidiary — FlipChip International, LLC.
FCI acquired IC Services, which became the Die Sales Division of FCI (or FCI-DSD). The Die Sales Division continues its long tradition of providing wafer thinning, dicing, Automated Optical Inspection (AOI), Waffle Pack, and Tape & Reel services.
FCI has been offering its flagship Spheron SFC and Spheron WLCSP product lines which are now widely accepted technologies in the portable handset space. Also in 2005, FlipChip International licensed the Fraunhofer Institute’s Electroless Ni/Au process leading to a new line of low cost flip chip and WLCSP CSP bumping offerings sold under the Elite UBM banner. Target applications of E-less Ni/Au UBMs include high temperature power devices, low cost RFID and WLCSP applications.
The new process has been in commercial production since mid-2006 at our FCMS joint venture in Shanghai.
FlipChip entered into a joint venture with Millennium Microtech Shanghai (MMS) to form FlipChip Millennium Shanghai (FCMS). FCMS opened in March of 2007 and provides “Full Turn- Key” wafer bumping and die packaging services, focusing on the Asian market.
FCI’s Elite SFC and Elite WLCSP product offerings were qualified and fully deployed at FCMS during the remainder of 2007. Also in 2007, FlipChip entered into strategic partnerships with select domestic test houses to enable the wafer sort as part of our Full Turn-Key supply strategy.
FCI-Phoenix has further broadened its product portfolio through the implementation of semi-additive Cu electroplating based processes which provide additional RDL and wafer bumping capabilities for WLCSP, embedded die and Cu Pillar Bumping applications on a growing range of substrate technologies including Silicon, Sapphire, and GaAs.
FCI entered into an additional Asian joint venture with Unisem called Unisem- Advanpack Technologies (UAT) located in Ipoh, Malaysia. This joint venture provides a mutually beneficial, Asia based second sourcing option for FCI’s customers using sputtered and electroplated Cu based wafer level processing technologies for wafer sizes up to 200 mm.
FCI entered into a 300 mm wafer bumping partnership with Semiconductor Manufacturing International Corporation (SMIC) located in the Pudong area of Shanghai. This partnership further broadens FCI’s abilities to support its wide range of Wafer Level Packaging product offerings across all standard wafer sizes.