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Our HistoryFlipChip International, LLC began life in 1996 as Flip Chip Technologies (FCT), a joint venture between Delco Electronics Systems and Kulicke & Soffa (K&S). Delco brought the patented Flex-On-Cap (or FoC) flip chip process and over 30 years of experience from the automotive industry. K&S added its vast knowledge and leadership position as the world's largest supplier of semiconductor assembly equipment. By any measure, the company was a huge success. The company's Flex-on-Cap (FoC) standard flip chip bumping technology quickly became the industry standard for flip chip bumping. In 1998, FCT developed and patented the UltraCSP® Wafer Level Chip Scale Package (WLCSP), which again, quickly became the industry standard for WLCSP. FlipChip began an aggressive licensing program to bring its unique bumping technology to a broader worldwide market. Today, the semiconductor industry's packaging heavyweights, including Amkor Technology, Advanced Semiconductor Engineering (ASE), Siliconware (SPIL), STATS ChipPAK, California Micro Devices, and National Semiconductor license and use FlipChip's bumping technology. In 2001, K&S acquired Delco's remaining interest in FCT and we became the Flip Chip Division of Kulicke & Soffa. With the strong backing of K&S, FlipChip weathered the Semiconductor Industry downturn of 2001-2002, emerging as the clear leader in bumping technical innovation. In 2004, RoseStreet Labs, LLC, a private research and development company based in Phoenix, completed the acquisition of substantially all of the assets of the Flip Chip Division from Kulicke & Soffa Industries, through its newly formed subsidiary FlipChip International, LLC. FlipChip International LLC (or FCI) continues the tradition of technical leadership and bumping excellence. In early 2005 FCI acquired IC Services, which became the Die Sales Division of FCI (or FCI-DSD). The Die Sales Division continues its long tradition of providing wafer thinning, dicing, Waffle Pack, and Tape & Reel services. In addition to bumping services, FlipChip has an aggressive program to develop and generate intellectual property for future implementation at FlipChip and for our licensee's. Our commitment to leadership and quality in wafer bumping solutions continues, ensuring that FlipChip remains the leader in developing, and bringing to market, the latest bumping technology. FlipChip is located in Phoenix, Arizona, USA, just south of Sky Harbor International Airport. We have a state of the art, 15,000-ft² (4600 m²) class 1000 clean room. FlipChip is QS9000 and ISO9001:2000 certified. |
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