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Productronica 2007
November 13-16, 2007
Munich
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Electroless Nickel--Gold Reliability (UBM, Flipchip and WLCSP)
November 14, 2005
The demand for solder bumping has increased dramatically in the past several years. A majority of all the Flip Chip (FC) and Wafer Level Chip Scale Packaging...
Development and Screening of Polymer Collar Candidates for Lead-Free Solder Sphere Technology to Enhanced Technology
November 14, 2005
Polymer reinforcement at the solder bump (sphere) joint is called a "polymer collar." This paper describes the affects of visco-elastic properties of two types of thermoset resin blends...