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FCI Tech Papers

• Electroless Nickel--Gold Reliability (UBM, Flipchip and WLCSP)
  November 14, 2005
  The demand for solder bumping has increased dramatically in the past several years. A majority of all the Flip Chip (FC) and Wafer Level Chip Scale Packaging...
• Development and Screening of Polymer Collar Candidates for Lead-Free Solder Sphere Technology to Enhanced Technology
  November 14, 2005
  Polymer reinforcement at the solder bump (sphere) joint is called a "polymer collar." This paper describes the affects of visco-elastic properties of two types of thermoset resin blends...