Bumping Design Options
Here we look at the different FlipChip International Wafer Level Processing services.
To make it easy, we have broken FlipChip International services into the different processes.
Each one is recommended for a different bumping situation, from the simplest to the most complex. Look these over and decide which process will meet your needs.
If you still can’t decide, give us a call! We’ll be glad to walk you through our available options and help you select the process that will work best for your application.
We are experts at matching up a standard process flow to your device. Keep in mind that we are a development driven engineering organization.
For non-standard devices, we can design a custom process flow that will meet your application’s specific requirements.