The Flipchip International Die Sales Division (DSD) offers substantial dicing options which include standard low tack and UV tapes. The saw operation contains a large library of blades and thickness to exposure ratio.
DSD also has automated high speed 100% inspection capabilities. Defect sensitivity for commercial and Mil-Standard criteria with wafer map input and output capabilities.
Die pick capabilities include high speed sort to tray or tape. Pick and Place has die inversion capability along with die sort to wafer map or ink dot recognition.
With industry leading process and product development expertise coupled with quick time to market and production ramp up capabilities on two continents, FCI continues to provide our customers with flexible, high reliability and high quality Wafer Level Packaging solutions. FCI … Miniaturization through Innovation