Phoenix, AZ Sep. 15, 2015 – FlipChip International – (FCI), the global technology leader in flip chip bumping and Wafer-Level Packaging, will be returning and exhibiting at the International Wafer-Level Packaging Conference (IWLPC) in San Jose, California on October 13-14th.
FCI invites you to join them at booth 29 at the 12th annual IWLPC. The annual SMTA and Chip Scale Review Conference brings together some of the leading experts in Semiconductor Advanced Packaging. Topics include MEMS packaging, 3D and Wafer-Level Packaging. FCI will be offering technical support on a broad range of advanced wafer level packaging technologies and highlighting world-class service, quality, and reliability. On display will be FCI’s product offerings which highlight FCI’s position as a technology leader in Wafer Level Packaging. These products provide global support to the world’s leading semiconductor and fabless semiconductor companies.
FlipChip International – (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, industrial and medical industries. FCI supports a wide range of customers, frequently partnering with them to engineer customized solutions including expedite bumping of Multi-Project Wafers. FCI is a leader in wafer level packaging with patented technologies spanning from Cu Pillar Bumping, Spheron™ Wafer Level Chipscale Packaging, and ChipsetT™ Embedded Die Packaging. FCI is a division of Tian Shui Huatian Technologies (TSHT). TSHT is among the top three Chinese OSATs and listed on the Shenzhen Stock Exchange Market. TSHT has six ISO/TS16949 factories located in the US and China offering a complete range of semiconductor packaging and turnkey services.
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