Dr. Hong Xie, the new general manager of FCI

On February, 2017, HUATIAN technology corporation is glad to announce the appointment of Dr. Hong Xie as the new general manager of FCI, a division of HUATIAN technology corporation. Due to the demanding needs of other responsibilities, the current FCI GM, Mr. Jerry Li, will no longer manage FCI and will focus on the responsibilities as the Corporate VP for International sales & marketing and as the GM for TSHT (Tian Shui Hua Tian).

Dr. Hong Xie obtained his bachelor and ...

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IEEE Electronic Components and Technology Conference

FCI will participate and exhibit at the 2017 ECTC conference at Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, May 30 – June 2, 2017. The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE.

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FlipChip International is attending the IWLPC Conference in San Jose, California, October 13th & 14th

Phoenix, AZ Sep. 15, 2015 – FlipChip International – (FCI), the global technology leader in flip chip bumping and Wafer-Level Packaging, will be returning and exhibiting at the International Wafer-Level Packaging Conference (IWLPC) in San Jose, California on October 13-14th.

FCI invites you to join them at booth 29 at the 12th annual IWLPC. The annual SMTA and Chip Scale Review Conference brings together some of the leading experts in Semiconductor Advanced Packaging. Topics include MEMS packaging, 3D and Wafer-Level Packaging. FCI ...

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Tianshui Huatian Technology Company Ltd announces the Acquisition of FlipChip International LLC

Phoenix AZ, April 30, 2015 –Tianshui Huatian Technology Company Ltd (TSHT) announced the completion of the acquisition of FlipChip International LLC (FCI) on April 1, 2015.

TSHT is the second largest Chinese provider of IC Testing and Packaging for semiconductor IC and components, and is growing fast on the international stage. The acquisition of FCI, the global technology leader in Flip Chip bumping and Wafer Level Packaging, adds a broad range of advanced wafer level packaging technologies, highlighting world-class service, quality, ...

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FlipChip International Announces Acquisition by TianShui Huatian Technology Co., LTD

Dear Valued FCI Customers and Partners,

Today TianShui Huatian Technology Co., LTD (TSHT – 002185:Shenzhen) announced to the Shenzhen Stock Exchange their intention to acquire 100% of FlipChip International LLC and its subsidiaries. A binding Letter Of Intent has been agreed by the Boards of both companies. The definitive agreement is due to be signed mid-December and shall be approved by or filed with the relevant US and Chinese regulatory authorities. We expect the transaction to close in mid-February  2015.

TianShui Huatian ...

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FlipChip International attending the International Wafer-Level Packaging Conference in San Jose, California on November 11-12th

Phoenix, AZ Nov. 5, 2014 – FlipChip International – (FCI), the global technology leader in flip chip bumping and Wafer-Level Packaging, will be returning and exhibiting at the International Wafer-Level Packaging Conference (IWLPC) in San Jose, California on November 11-12th.

FCI invites you to join them at booth 29 at the 11th annual IWLPC. The annual SMTA and Chip Scale Review Conference brings together some of the leading experts in Semiconductor Advanced Packaging. Topics include MEMS packaging, 3D and Wafer-Level Packaging. ...

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FlipChip International Attending TowerJazz Technical Symposium in Newport Beach, California on November 19th, 2014

Phoenix, AZ  November 3, 2014 – FlipChip International – (FCI), the global technology leader in Flip Chip bumping and Wafer Level Packaging, will again this year be in attendance and exhibiting  at the TowerJazz Technical Global Symposium in Newport Beach, California on November 19th.

FCI will be participating in this event for the fifth consecutive year supporting the relationship with TowerJazz and their customers who have provided many of the 250 ...

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FlipChip International Exhibiting at Electronica, November 11-14, Munich

Phoenix, AZ  October 30, 2014 – FlipChip International – (FCI), the global technology leader in Flip Chip bumping and Wafer Level Packaging, will be exhibiting at the Electronica Trade Fair. FlipChip will be in Hall A6, Booth 278.

At Electronica, FlipChip will be providing customer support on a broad range of advanced wafer level packaging technologies, highlighting world-class service and reliability. FlipChip will also be promoting its increasing capabilities in high volume IC Assembly and Test, following the acquisition of Learn More →

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FlipChip International Creates 250 Multi-Product Wafer Bump Designs

Phoenix, AZ  October 1st, 2014 – FlipChip International – (FCI), the global technology leader in flip chip bumping and advanced wafer level packaging, announced that their engineering team had completed design and production of the 250th Multi-Product Wafer Bump design since January 2013.

Multi-Product Wafer (MPW) Bump Designs are complex and challenging to create but provide a way for customers to quickly test multiple IC designs and provide samples to customers. MPW wafers have many different ICs fabricated on the same ...

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FlipChip International and Fujikura Limited Participating in the Packaging and Assembly Considerations in Wearable Electronics Workshop

Phoenix, AZ  June 9th, 2014 – FlipChip International – (FCI), the global technology leader in flip chip bumping and wafer level packaging, announced that their CTO, Ted Tessier, will be presenting a collaborative paper with Fujikura Limited entitled “Enabling Wearable Electronics:  Innovation Through Miniaturization” at the TechSearch International Packaging and Assembly Considerations in Wearable Electronics Workshop  to be held in Austin, Texas on June 11th and 12th, 2014.

At the workshop, FCI and Fujikura will be presenting a unique perspective on ...

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FlipChip International is attending the MagnaChip Semiconductor Corporation Foundry Technology Symposium

Phoenix, AZ May 12, 2014 – FlipChip International – (FCI), the global technology leader in Flip Chip bumping and Wafer Level Packaging announced they will sponsor the MagnaChip Semiconductor Corporation’s 4th Annual Foundry Technology Symposium in Hsinchu, Taiwan on Wednesday, May 21st and in Santa Clara California on Thursday, June 12th.

At the symposium, FlipChip will provide information and support on a broad range of advanced wafer level packaging technologies, highlighting world-class service and reliability. FlipChip will also be promoting its ...

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FlipChip International at IMAPS 2014

Phoenix, AZ  March 10th – FlipChip International – (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced they will give the following paper at the IMAPS – 10th International Conference and Exhibition on Device Packaging 2014 in Scottsdale Arizona, USA.

Dielectric Laser Via Drilling for Next Generation Wafer Level Processing

Jim Zaccardi, FlipChip International (Guy Burgess, Theodore Tessier, FlipChip International; Matt Souter, SUSS MicroTec Photonic Systems Inc.) 

The common via formation processes used today for dielectrics in WLCSP RDL ...

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FlipChip International to Exhibit and Present at 10th Annual IMAPS Conference

FlipChip International invites you to join us at:

IMAPS International Conference and Exhibition on Device Packaging

Exhibit Hours: Tuesday, March 11 – 10:00 AM – 7:00 PM; Wednesday, March 12 – 10:00 AM – 4:00 PM
Radisson Fort McDowell Resort, Scottsdale / Fountain Hills, Arizona
Booth #45

FlipChip International – (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries.  FCI supports a wide range of customers from each industry, frequently partnering with ...

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FlipChip International Announces 100% Ownership of Millennium Microtech (Shanghai) and FCMS

Phoenix, AZ November 12th – FlipChip International – (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today the 100% acquisition of Millennium Microtech (Shanghai) – (MMS), a provider of fully integrated semiconductor packaging and testing services situated in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China. The MMS name will be changed to FlipChip International.

FCI acquired a majority shareholding in MMS in July 2012 and have since worked diligently with the ...

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FlipChip International to Sponsor TowerJazz TGS

FlipChip International will be sponsoring TowerJazz Technical Global Symposium, held in Newport Beach, California, U.S.A.

We will also be in attendance Tuesday and Wednesday, November 12th and 13th at the Hyatt Regency Irvine, located at 17900 Jamboree Road, Irvine, California 92614.

 

TowerJazzLogo2013

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FlipChip International announces the Appointment of David Wilkie as President and Chief Executive Officer

Phoenix, AZ, September 3rd, 2013 – FlipChip International – (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging, announced today the appointment of David Wilkie as President and Chief Executive Officer. A graduate of Edinburgh University, David Wilkie brings 23 years of engineering management experience to FCI including the last three years as Director of the Memory Products Division of Microchip Technology. The FCI committed strategy to provide engineering excellence in device miniaturization and innovation in ...

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