FlipChip International (FCI) in the News
FCI Attended Productronica 2011:
December 1st, 2011
PHOENIX, ARIZONA, Dec. 1st 2011—FCI attended Productronica
in booth 517,hall A2 during the Productronica exhibition, November 15-18
in Munich, Germany. FCI was joined by embedded die technology partner, Fujikura
and announced the new ChipletT and ChipsetT embedded
die packaging solutions.
If you missed FCI at Productronica, contact us
here
for more information on ChipletT & ChipsetT solutions.
FlipChip International and Fujikura Ltd. Announce ChipletT / ChipsetT Ultra Thin 3D Packages
November 10, 2011
Phoenix, Arizona - November 10, 2011 - FlipChip International, LLC USA (FCI) and Fujikura Ltd. (President: Yoichi Nagahama) today announced ChipletT and ChipsetT embedded die packages for single die or multi-die semiconductor packaging applications.
FCI Appoints David Hays as Eastern USA Sales Representative:
September 1st, 2011
PHOENIX, ARIZONA, Sep. 1st 2011—FCI is pleased to announce the appointment
of David Hayes as our Eastern USA sales representative. He will represent FCI from the North of Main
to the South of Florida continuing west to the Mississippi River. David has extensive experience in the
Semiconductor Services industry , particularly in wafer level packaging, and is based out of Cary, North Carolina.
FCI has no doubt that David will be a valuable asset in the service and support of our customers in the territory.
David can be contacted at:
Phone: (919) 638-1654
Email: progressionsolutns@att.net
FlipChip International and Fujikura Forge Partnership for Advanced Semiconductor Packaging Technologies
June 13, 2011
Tokyo, Japan – June 13, 2011 – Fujikura Limited today announced an exciting collaboration with FlipChip International, LLC of Phoenix, Arizona USA on next generation semiconductor packaging technology. FCI and Fujikura have agreed to partner on the further development and commercialization of next generation semiconductor packaging including flexible substrate based embedded die, Fan-Out packages, and high density, 3D interposer technologies.
FlipChip International Announces Next Generation Adaptable NANOPillar™ Bumping Technology for Lead-free Fine Pitch Flip Chip and 3D Packaging Applications.
November 9, 2009
PHOENIX, ARIZONA, Nov. 9th 2009—FlipChip International today announced a major step forward in semiconductor package miniaturization with its NANOPillar™, wafer bumping technology. NANOPillar™ wafer scale bumping delivers for the first time, highly adaptable lead-free solder capping for extremely tight tolerance stand-off geometries in demanding applications including smart phones and portable medical devices.
FlipChip International and IC Interconnect Announce U.S. Sales and Marketing Agreement for Wafer Level Packaging Services.
October 26, 2009
FlipChip International, (FCI), the global technology leader in flip-chip bumping and Wafer Level Packaging and IC Interconnect (ICI), a TS16949 registered leader in electroless Nickel flip-chip bumping and Wafer Level Packaging announced today a U.S. joint Sales and Marketing agreement.
FCI announces 300mm Strategic Partnership with SMIC.
March 16, 2009
Shanghai, China – TKTK, March 16, 2009 – FlipChip International, (FCI), the global technology leader in flip-chip bumping and wafer level packaging, announced today…
FCI announces ITAR Registration and Approval.
October 28, 2008
FlipChip International announces successful International Traffic in Arms Regulations (ITAR) registration from the US Department of State, Bureau of Political-Military Affairs…
Hermes European Embedded Die Consortia Selects FCI's EDC™ Technology
July 8, 2008
Hermes, the European consortia for the development and industrialization of embedded die technology has announced FlipChip International, LLC as an associate partner…
Unisem and FCI Sign Licensing Agreement For Wafer Bumping and Wafer Level Packaging Technologies
June 16, 2008
Partnership with UAT Allows FCI to Extend Its Reach to the Asian Markets. Unisem (M) Berhad (Unisem) and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) announced today that they have entered into an agreement with FlipChip International, LLC (FCI) for the licensing of FCI's wafer bumping and wafer level packaging technologies…
FCI’s EDC™ Enables Embedded Die Packaging
November 14 , 2007
FlipChip International today announced the introduction of its new EDC™, Embeddable Die Customization™ technology targeted at readying integrated circuits…
FCI announces Expansion of DSD Fab to 3 Million Die Weekly Capacity
November 13 , 2007
FlipChip International, LLC (FCI) announced the completion of its first phase expansion in Q4 2007 of its Die Sales Division (DSD) fab in Tempe, AZ.…
FCI appoints David McComb Vice President Sales and Marketing
September 24, 2007
FlipChip International, LLC, announced today that it has appointed David McComb as Global Vice President Sales and Marketing for its semiconductor wafer scale packaging and bumping business…
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