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Dicing

When wafer dicing (singulation) is required, FCI provides high accuracy, high volume dicing capability.

• The dicing process is fully automated – with cassette to cassette load/unload up to 8 inch wafer diameter.
• Real time process controls are used to insure control and capability.
• Dual spindle saw blades are used for optimum quality and throughput.
• Bumped and non Bumped wafers can be sawn.
• A variety of clean, non residue tapes are available including UV.

The saw capability is:

• Saw street width – 4 mils/100microns – preferred
• 3 mils/75 microns – minimum

Click on the "How to Get Started" link to complete the necessary information required to start an order.