PATENT INFORMATION

The purchase of any of the following wafer bumping services or products instruments listed in the table below are covered by one or more U.S. Patents and their foreign counterparts as indicated in the table below.   If you do not see a particular FCI product listed below, please feel free to contact Dawn Cuevas at 602-431-6637 for further information on its intellectual property status.

 

FCI Service and Product Type

    Covered by one or more of the following FCI U.S. patents and their foreign counterparts
   

UltraCSP™

6,441,487; 6,750,135; 6,287,893, 7,057,292; 7,973,418; 8,058,163; 8,143,722; and patents pending

Spheron(tm) WLCSP

6,441,487; 6,750,135; 6,287,893, 7,057,292; 7,973,418; 8,058,163; 8,143,722; 8,188,606 and patents pending

Elite UBM

6,445,069 and patents pending

Elite CSP

6,445,069; 6,441,487; 6,750,135; 6,287,893, 7,057,292; 7,973,418; 8,058,163; 8,143,722; 8,188,606  and patents pending

3-D WLCSP

 6,441,487; 6,750,135; 6,287,893, 7,057,292; 7,973,418; 8,058,163; 8,143,722; 8,188,606 and patents pending

Spheron(tm) Embedded Die RDL

 6,441,487; 6,750,135; 6,287,893, 7,057,292; 7,973,418; 8,058,163; 8,143,722; 8,188,606 and patents pending

ChipsetT(tm); ChipsetT(tm)

 6,441,487; 6,750,135; 6,287,893, 6,919,508; 7,057,292; 7,011,988; 7,973,418; 8,058,163; 8,143,722; 8,188,606 and patents pending

Polymer Collar

6,578,755; 7,118,833; 7,126,164 and patents pending