A new ultra thin advanced embedded die packaging solution suitable for single and multi-die System in Package applications.
Based on Fujikura WABE™ Technology, this product family offers unrivaled package form factor reduction compared with alternative embedded die technologies while maintaining industry leading reliability performance. An innovative package platform that opens new doors to system layout and design freedom through its inherent enhanced functional density.
* Improved Package Robustness
* Form Factor Miniaturization
* Enhanced Thermal Dissipation
* Full 3-D Package Integration
* Low RF Loss
In Partnership with:
Want to learn more? – contact our applications experts to discover how ChipletT and ChipsetT can open new doors to package integration.