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Additional Finishing ProcessesLaser MarkFor die identification and traceability, FlipChip gives you the option of using a laser to mark the backside of each die. FlipChip can mark any alphanumeric character down to a minimum character size of 0.15 mm square with a character depth of approximately 10-15µm. Simple graphics including circles, squares, triangles, etc. can be used for the optional pin 1 indicator. We can even mark simplified graphics consisting of basic shapes including circles, squares, triangles, etc. for company logos. FlipChip has the capability to accurately mark any die to a minimum die dimension of 0.8 mm. If you have die smaller than 0.8 mm, give FlipChip a call. We can custom match a laser program for your needs. Backside CoatingIf desired, FlipChip can coat the backside of the wafer with a black opaque coating. The coating is an epoxy based coating with a silica filler and carbon black for color. This coating strengthens the die by minimizing "chip-outs" during dicing. The coating "Laser marks" very well. It also provides a nice "finished package" look to the die. Electronic Wafer Yield MapsWafer yield mapping data is either presented on paper (shipped with the wafers) or by electronic wafer maps (transmitted over secure FTP sites). FlipChip uses Simplified INF (SINF), the industry standard file format, for all electronic wafer maps. FTP sites can be easily and quickly set up for secure data transfer. Contact FlipChip for details. |
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