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Backgrind

“In Process” Backgrind

Many times, wafers need to be thinned to meet final packaging requirements. For UltraCSP, Spheron WLP, and Polymer Collar WLP, FlipChip has the ability to backgrind wafers, during processing, just before the solder balls are applied. Wafers are course ground with a wheel of 320-360 grit and polished ground with a wheel of 2000 grit. Below are our backgrinding/processing capabilities. Please contact FlipChip if you have thinner backgrinding requirements.

Table 1. WLP Wafer Thickness After “In Process” Backgrinding

“After Bump” Backgrind

Many times, wafers need to be thinned to meet final packaging requirements. For Standard Flip Chip products, FlipChip has the ability to backgrind wafers after the bumps are applied. Wafers are course ground with a wheel of 320-360 grit and polished ground with a wheel of 2000 grit. Below are our backgrinding/processing capabilities. Please contact FlipChip if you have thinner backgrinding requirements.

Table 2. Standard Flip Chip Wafer Thickness using “After Bump” Backgrinding

Incoming Wafer Thickness

It is always preferable for CFI to receive "Full Thickness" wafers. If your wafers need to be thinned prior to shipment to FCI, the following table gives the minimum thickness requirements. Wafers thinned before processing must have at least a 2000 grit final polish. It is preferred that the wafers are also "stress relieved". If you need wafers that are thinner, consider the option of backgrinding the wafers during processing at FlipChip.

Table 3. Incoming Wafer Thickness Requirements