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EliteCSP
EliteCSP® is our newest offering in Wafer Level Chip Scale Packaging (or WLCSP). Produced under license from the Fraunhofer Institute (IZM) in Berlin, EliteCSP is a low cost, high volume process that uses a 5µm thick Electroless Nickel Under Bump Metallization layer (or E-less Ni UBM). After the wafers receive the E-less Ni UBM, solder is applied to the wafers using the standard FlipChip ball drop process. Bump heights for the process range from 200µm to 450µm. In this process, pre-formed solder balls of 250µm to 500µm are placed on the wafer and reflowed. The bumps placed using EliteCSP, are placed directly on the device I/O's. Typically, the number of bumps per die is 4-100. Die bumped with EliteCSP do not require underfill until the bump array reaches the 6x6 to 7x7 size. (Then underfill may be needed.) This lack of underfill makes it easy to migrate from TSOP or QFP to EliteCSP. EliteCSP is classified as JEDEC Level 1 compliant. View a summary of the EliteCSP process. |
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