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SFC Redistribution Process Summary
Deposit and pattern first layer of BCB passivation (BCB1). 
Deposit six layer (Al/NiV/Cu/Ti/NiV/Cu) UBM stack. 
Etch UBM stack to form redistribution runners and bump pads (or studs). 
Deposit, pattern, and cross-link second layer of BCB passivation (BCB2). 
Deposit solder paste (Proprietary Process). 
Reflow solder. |
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