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Semicon West 2008
July 15-17, 2008
San Francisco
Visit us in the West Hall – Level 2 booth 8121
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Home / Services / Wafer Level Services / Solder Alloy /
Solder Availability Table
The table below lists the availability of solder alloys for the standard bumping processes. If a desired alloy is not listed for the process your device uses, contact FlipChip. In most cases, we can bump your device with the solder you need.
Table 1. Table of Solder Availability
| Process / Alloy |
Sn/Ag/Cu Lead Free - LF2 |
63Sn37PbStd. Eutectic |
63Sn37Pb Low Alpha |
63Sn37Pb Ultra Low Alpha |
95Pb5Sn High Lead |
| SFC-Bump on I/O |
Yes |
Yes |
Yes |
Yes |
N/A |
| SFC-Repassivation |
Yes |
Yes |
Yes |
Yes |
N/A |
| SFC-Redistribution |
Yes |
Yes |
Yes |
Yes |
N/A |
| UltraCSP WLCSP |
Yes |
Yes |
Yes |
N/A* |
Yes |
| Spheron WLCSP |
Yes |
Yes |
Yes |
N/A* |
Yes |
| Polymer Collar WLCSP |
No |
Yes |
Yes |
N/A* |
No |
*N/A = Not Available as a standard product. However, please contact FlipChip if you have a specialty application that requires non-standard solder.
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