 |
 |
Process Summary
Coat first Spheron layer (Spheron1), expose, develop, and cure. 
Sputter metal redistribution layer. Pattern and etch to form redistribution runners. 
Coat second Spheron layer (Spheron2), expose, develop, and cross-link. 
Deposit and pattern three layer UBM (Al/NiV/Cu). 
Attach pre-formed solder ball. 
Reflow Solder |
||
