Phoenix AZ, April 30, 2015 –Tianshui Huatian Technology Company Ltd (TSHT) announced the completion of the acquisition of FlipChip International LLC (FCI) on April 1, 2015.
TSHT is the second largest Chinese provider of IC Testing and Packaging for semiconductor IC and components, and is growing fast on the international stage. The acquisition of FCI, the global technology leader in Flip Chip bumping and Wafer Level Packaging, adds a broad range of advanced wafer level packaging technologies, highlighting world-class service, quality, and reliability on a global basis to the TSHT strong product portfolio. The combined product lines of TSHT and FCI will offer a complete range of semiconductor packaging and turnkey services to meet customer needs on a worldwide basis.
Jerry Li newly appointed General Manager at FCI said, “I am excited about the opportunities that this will bring to the TSHT, introducing both the FCI Phoenix and Shanghai facilities to the Huatian Group of Companies brings a new complimentary set of customers to the company. TSHT sees the value in FCI’s technology and the employee expertise, and looks forward to taking our business to the next level.”
About TSHT: TianShui Huatian Technology Co., Ltd is a leading Chinese provider of IC Testing and Packaging for Semiconductor IC and components, listed in Shenzhen Stock Exchange Market.
For information contact:
FlipChip International, a division of the Tianshui Huatian Technology Co.