In July 2018, Huatian Technology announced a three-phase development plan for an IC packaging and testing plant in Nanjing. This circuit advanced packaging and testing industry base project will focus on memory and artificial intelligence chips, as well as microelectromechanical systems (MEMS).

The total investment of the project will reach 8 billion yuan ($1.20 billion), which will be completed in three phases. All projects will be completed and operated no later than December 31, 2028. The project is located in Qiaolin Park, Pukou Economic Development Zone, Nanjing, with a land area of about 500 acres. The project has started the groundbreaking ceremony in January 2019.